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Facility Tour
Take a brief look at our EMS capabilities and investments we’ve made in environmentally controlled facilities, advanced equipment and processes that insure the most effective solutions for manufacturing of your electronics products . . .
In-House Taping and Reeling
To accommodate lead-time requirements, Spectra-Tech utilizes in-house taping and reeling for SMT chip requirements. This allows us
to better manage your order with limited outsourcing from incoming material to final delivery.
Inventory/Materials Management
We control an efficient inventory system that is effectively managed to maximize work in process at all times. Spectra-Tech continually
optimizes the materials management process with our new, customized ERP system.
Component Prep
Prior to through-hole or mixed technology assembly, our parts prep team develops, documents and implements a rigorous and repeatable
process for preparing boards and components. Our prep process is designed to handle a wide range of customized setups and special requests.
Surface Mount Assembly Lines
Spectra-Tech’s high-speed SMT manufacturing capabilities include 3 state-of-the-art Fuji assembly lines — each capable of
mounting up to 40,000 components per hour. All assembly lines incorporate screen printing, placement and solder reflow with interchangeable
capabilities that provide maximum flexibility on production runs. Thermal profiling is always performed for in-process quality inspection —
including a 10-zone profiling oven if required. Capabilities such as BGA placement and up to 150,000 component/hour placement are also available,
as needed.
Slide-line Assembly
For through-hole and mixed technology assembly, Spectra-Tech has a highly efficient, static-controlled slide-line for drop-in placement.
Our skilled technicians work from detailed documentation, assuring a consistent and accurate drop-in process with maximum flexibility to manage
customized builds, prototypes, and all change requests.
Wave Soldering
After drop-in assembly is completed on the slide line, components are soldered on one of our two soldering machines. We utilize the wave
solder process for boards that do not require selective or manual soldering.
Selective Soldering Machine
Our advanced selective soldering machine uses programmable nozzles for point-to-point soldering. This provides a critical advantage by
automatically performing intricate solder connections that previously required hand soldering — resulting in greater speed and accuracy.
We can operate the selective soldering machine 24/7 and dramatically reduce the volume and cost of solder used in the process – also making
this an ideal solution for RoHS compliant applications.
Hand Soldering
Spectra-Tech performs hand soldering for situations demanding special soldering requirements. This includes prototype production,
special customization and lead-free applications.
Automatic Optical Inspection (AOI)
For first board inspection and final inspection, we use Automatic Optical Inspection (AOI). This amazing machine has top-down viewing
cameras and four side viewing cameras for inspecting solder joints and verifying correct part assembly. With the ability to scan over 1500
components/minute, Spectra-Tech now uses AOI to inspect nearly 100% of our production boards.
Functional Testing
Spectra-Tech performs customer-defined functional tests using Manufacturing Defect Analyzer (MDA) test fixtures, as well as In-Circuit
Test (ICT) and outsourced testing methods such as “flying probe” testing.
Box Build
Spectra-Tech is capable of building complete product assemblies, including final box assembly and packaging. We have the materials
management and custom assembly expertise to insure a defect-free box build process to your specifications.
Conformal Coating
If you have special requirements, Spectra-Tech can apply a conformal coating to electronic assemblies. This provides protection against
moisture, dust, chemicals and temperature extremes.
Prototype Build
Our prototype engineering/build team will review your product design, develop a finished prototype and then develop an effective
production process. This may involve hand-built prototypes or Fine Pitch Placement equipment for positioning of BGA (Ball Grid Array)
and CSP (Chip Scale Package) devices.
Frequently prototype tooling can be transferred or adapted directly to the manufacturing floor with minimal modification and engineering costs — speeding your product to market.
Lead & Lead-Free Capability
Whether your product requires lead-free, RoHS compliance or not, Spectra-Tech will provide the right manufacturing process for your needs.
We offer conventional wave solder, hand soldering or selective soldering capabilities to accommodate both lead and lead-free requirements.
Spectra-Tech’s materials management team has established sourcing relationships with certified lead-free material and component suppliers to
assure manufacturing of lead-free assemblies.
Want to see more?
You are welcome to visit our facility in Batavia, Ohio anytime and observe our manufacturing process.
Contact us today about setting a date for your tour of Spectra-Tech.